PCB Technologies Update: Substrate Materials & Embedded Passive Componentsחינם לחברי האיגוד

14:00- 13:45

Registration & gathering

14:00-15:30

Substrate Materials production Process: Today, PCBs designs push the limits of electrical performance to support the growth of high-tech products, better features are required in the insulating layers and weaving of glass fibers for speed and reliability.Higher quality is required in printed circuit design, especially in HDI technologies and in accordance with micro-Via drilling. The speaker will present techniques production of glass fibers, as well as types of glass fiber weaving.

15:30-15:45

Coffee Break

15:45-17:00

Embedded Passive Components: Today, a typical PCB contains over 70% of passive components: capacitors, resistors and inductors, which reduce the circuit area for functionality.

The market needs for reducing product’s size without losing functionality, or for adding functionality without increasing product size, are the main driving forces for increasing PCB’s functional area efficiency.

Passive Components technology has potential to meet the requirements of customers for more functionality.

The speaker will present examples of embedded passives, and discuss the design and production challenges.

17:15

Q&A